DieMark Inking Products

2666-56 Conductive Ink

2666-56 is a fast drying, silver filled ink, designed for producing electrically conductive traces on rigid and flexible circuit boards. This material provides excellent adhesion to aluminum, silicon, glass, Mylar, Kapton, and a variety of other substrates. This product also features a unique drying rate which allows for up to 20 minutes between dispenses without readjustment or cleaning being required.

Additional applications for 2666-56 include emi/rfi shielding, polymer thick film circuitry, membrane switches and circuit repair.

Samples are now available in DM-2 A8 cartridge only.

To request samples, contact: insidesales@xandex.com

2666-56 Features and Benefits

• Low Viscosity
• 87% silver when cured
• Available in DM-2 A8 cartridge only
• Dot size range 22-34 Mil (DM-2 A8 cartridge size)
• Good Crease Resistance
• Excellent Adhesion
• Excellent Hydrolytic Stability
• Useful Temperature Range (°C) -55 to +150
• Volume Resistivity (Ω-cm) 0.00013 when cured at 65°C or 0.00005 when cured at 150°C
• Sheet Resistivity (Ω/sq/mil) 0.05 when cured at 65°C or 0.02 when cured at 150°C

Data Sheet Link

View/Download a PDF of the Conductive Ink Data Sheet

Note: All ink dot characterization testing performed at ambient temperature of 70° F, relative humidity of 40%, using polished, unetched silicon wafers (no passivation).

Note: The use of a vortex mixer to re-suspend the silver is required prior to use of the cartridge.